发明名称 |
Thermal control layer in miniature LHP/CPL wicks |
摘要 |
A LHP/CPL wick includes an unconsolidated wick portion positioned within a first consolidated wick portion and a second consolidated wick portion. This wick provides a large DELTAT across the wick, and sufficient capillary action for miniature LHP/CPL applications. Furthermore, the unconsolidated wick portion allows accommodation of mismatched coefficients of thermal expansion. A LHP/CPL having this wick is particularly applicable to silicon cooling devices.
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申请公布号 |
US2003075306(A1) |
申请公布日期 |
2003.04.24 |
申请号 |
US20010039444 |
申请日期 |
2001.10.19 |
申请人 |
ZUO JON;KHRUSTALEV DMITRY;PHILLIPS ALFRED L. |
发明人 |
ZUO JON;KHRUSTALEV DMITRY;PHILLIPS ALFRED L. |
分类号 |
F28D15/04;(IPC1-7):F28D15/00 |
主分类号 |
F28D15/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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