发明名称 Thermal control layer in miniature LHP/CPL wicks
摘要 A LHP/CPL wick includes an unconsolidated wick portion positioned within a first consolidated wick portion and a second consolidated wick portion. This wick provides a large DELTAT across the wick, and sufficient capillary action for miniature LHP/CPL applications. Furthermore, the unconsolidated wick portion allows accommodation of mismatched coefficients of thermal expansion. A LHP/CPL having this wick is particularly applicable to silicon cooling devices.
申请公布号 US2003075306(A1) 申请公布日期 2003.04.24
申请号 US20010039444 申请日期 2001.10.19
申请人 ZUO JON;KHRUSTALEV DMITRY;PHILLIPS ALFRED L. 发明人 ZUO JON;KHRUSTALEV DMITRY;PHILLIPS ALFRED L.
分类号 F28D15/04;(IPC1-7):F28D15/00 主分类号 F28D15/04
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