Electronic device having a plastic housing and components of a height-structured metallic leadframe and methods for the production of the electronic device

摘要

An electronic device has a plastic housing. The plastic housing has components of a height-structured metallic leadframe. The components are in a matrix form and contain contact islands and chip islands on the underside of the plastic housing. Furthermore, the electronic device has a first line structure containing height-structured interconnects on the underside of the plastic housing and a second line structure containing bonding connections which are disposed within the plastic housing.