发明名称 |
Abscheidevorrichtung |
摘要 |
A method of plating which improves the uniformity of a plated coating thickness without changing the flow velocity of a feed plating solution. An aperture at a center of a mesh anode electrode of a plating apparatus produces an electric field density distribution between the mesh anode electrode and a wafer that is lower in the central portion of the wafer than at the edge portion of the wafer. |
申请公布号 |
DE19803490(C2) |
申请公布日期 |
2003.04.24 |
申请号 |
DE1998103490 |
申请日期 |
1998.01.29 |
申请人 |
MITSUBISHI DENKI K.K., TOKIO/TOKYO |
发明人 |
KOSAKI, KATSUYA;TAMAKI, MASAHIRO |
分类号 |
C25D5/08;C25D7/12;C25D17/00;C25D17/12;H01L21/288;(IPC1-7):H01L21/288;H01L29/41 |
主分类号 |
C25D5/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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