| 发明名称 |
ALIGNMENT AND PACKAGING METHODS AND APPARATUS FOR OPTOELECTRONIC, MICRO-ELECTRO MECHANICAL SYSTEMS, AND OPTICAL DEVICES |
| 摘要 |
<p>Precise positioning of components on support structures is achieved through modifications of properties of the support structure. Improved optoelectronic devices and optoelectronic packages are presented. In addition, improved methods and apparatus are presented for applications such as fabrication, repair, and alignment optimization of optoelectronic packages and optical devices.</p> |
| 申请公布号 |
WO03034098(A2) |
申请公布日期 |
2003.04.24 |
| 申请号 |
WO2002US32876 |
申请日期 |
2002.10.15 |
| 申请人 |
DHINDSA, RAJINDER;WOON, CALVIN;SINGH, NAVRIT |
发明人 |
DHINDSA, RAJINDER;WOON, CALVIN;SINGH, NAVRIT |
| 分类号 |
G02B6/42;H01S5/022;(IPC1-7):G02B/ |
主分类号 |
G02B6/42 |
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