INTERCONNECT SYSTEM AND METHOD OF FABRICATION

摘要

Embodiments of the present invention relate generally to interconnect systems. One embodiment relates to an interconnect system (11) having a first substrate (10), and a standoff (20) that extends from said first substrate. The interconnect system further includes a cap (22), intended for subsequent reflow attachment, that covers a first end of the standoff and does not cover the sides of the standoff. The interconnect system further includes a nonwettable surface layer (24) on the sides of the standoff such that the cap is prevented from substantially wetting the sides of the standoff when the cap is in a fluid state. The interconnect system may further include a second substrate (28) attached to the cap where substantially all of the cap is located at the first end of the standoff. Another embodiment of the present inventions relates to a method of fabricating the interconnect system.