发明名称 |
Method for manipulating MEMS devices, integrated on a wafer semiconductor and intended to be diced one from the other, and relevant support |
摘要 |
A method for manipulating MEMS devices integrated on a semiconductor wafer and intended to be diced one from the other includes bonding of the semiconductor wafer including the MEMS devices on a support with interposition of a bonding sheet. The method may also include completely cutting or dicing of the semiconductor wafer into a plurality of independent MEMS devices, and processing the MEMS devices diced and bonded on the support in a treatment environment for semiconductor wafers. A support for manipulating MEMS devices is also included.
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申请公布号 |
US2003077881(A1) |
申请公布日期 |
2003.04.24 |
申请号 |
US20020214998 |
申请日期 |
2002.08.08 |
申请人 |
STMICROELECTRONICS S.R.L. |
发明人 |
GELMI ILARIA;SASSOLINI SIMONE;POZZI STEFANO;GARAVAGLIA MASSIMO |
分类号 |
B81C1/00;(IPC1-7):H01L21/301 |
主分类号 |
B81C1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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