| 摘要 |
This invention relates to a method for positioning two stages during semiconductor wafer processing. More particularly, the invention facilitates the use of two stages to improve system throughput by decreasing the rest-time of certain system components. While a typical single-stage apparatus requires that each step in the process be performed serially, this invention allows an amount of parallel processing with each stage at different steps of the process, and thus improves system throughput.
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