发明名称 |
Socket apparatus and method for removably mounting an electronic package |
摘要 |
A socket (10) has a plurality of contacts (13) arranged in base (11). Each contact has one arm (13a) for contacting a solder ball of an electronic package (2). A slider (12) has a seat (12a) for package (2), a plurality of terminal receiving holes (12b), a terminal engagement surface (12c) formed at each terminal receiving hole for engagement with a respective solder ball and a plurality of contact receiving holes (12d). When slider (12) is moved in one directions package (2) can be seated with each ball disposed in a respective terminal receiving hole. When the slider returns, each ball is elastically contacted between an arm (13a) and a terminal engagement surface (12c).
|
申请公布号 |
US2003076123(A1) |
申请公布日期 |
2003.04.24 |
申请号 |
US20010012864 |
申请日期 |
2001.10.22 |
申请人 |
IKEYA KIYOKAZU;KATAYOSE KYOZO |
发明人 |
IKEYA KIYOKAZU;KATAYOSE KYOZO |
分类号 |
G01R31/26;G01R1/04;G01R1/073;H01R33/76;H01R43/00;H01R43/26;(IPC1-7):G01R31/02 |
主分类号 |
G01R31/26 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|