| 摘要 |
<p>A device (12) adapted for mounting semiconductor components to substrates includes a housing (24) and a first member (44) rotatably mounted to the housing (24). A first interface (45) is formed between the first member (44) and the housing (24). The device (12) also has a second member (60) mounted in the first member (44). The second member (60) is movable in an axial direction relative to the first member (44) between a first position, in which it extends from the first member (44), and a second position, in which it is retracted from the first position. The second member (60) has an engaging member (64) at an end thereof for engaging a semiconductor component when the second member (60) is in its first position. A second interface (61) is formed between the first and second members (44, 60). The device (12) is also provided with a supplying mechanism for supplying pressurized air to the first and second interfaces (45, 61) so as to form a first air bearing (88) at the first interface (45) and a second air bearing (90) at the second interface (61). The first air bearing (88) permits substantially frictionless rotational movement of the first member (44) relative to the housing (24), while the second air bearing (90) permits substantially frictionless rectilinear movement of the second member (60) relative to the first member (44).</p> |
