| 摘要 |
In accordance with the invention, an open frame circuit assembly mounted on a planar substrate is provided with a composite low flow impedance voltage guard. The composite guard comprises an ESD protective cover portion and a clip portion to capture the cover portion and clip to the circuit board. The cover portion comprises a lower frame member extending peripherally around the assembly, an apertured top member overlying the assembly and a plurality of spaced apart struts supporting the top member from the frame. The top member and struts have rounded surfaces to preserve streamlines in air flowing over the assembly, and all openings and spacings are sufficiently small to preclude accidental human contact with the assembly. Large area portions of the cover portion are preferably made of polymer containing conductive fillers for ESD protection. The clip portion is preferably made of high elongation polymer for secure holding and clipping.
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