| 发明名称 |
HERSTELLUNGSMETHODE EINES OBERFLÄCHEN-MONTIERBAREN BAUTEILS UND DIESER SELBST |
| 摘要 |
The invention relates to a method of manufacturing a semiconductor device (1) for surface mounting. According to the invention, the semiconductor devices are packaged while they are still on a slice of semiconductor material, while the package leads are formed from the semiconductor material. The method renders possible semiconductor devices of very small dimensions. In addition, integrated circuits with very many package leads can be manufactured in a simple manner without additional steps being necessary. <IMAGE> |
| 申请公布号 |
DE69528515(T2) |
申请公布日期 |
2003.04.24 |
| 申请号 |
DE1995628515T |
申请日期 |
1995.07.05 |
| 申请人 |
KONINKLIJKE PHILIPS ELECTRONICS N.V., EINDHOVEN |
发明人 |
DEKKER, RONALD;MAAS, GODEFRIDUS;VERSLEIJEN, PIETER |
| 分类号 |
H01L21/60;H01L21/68;H01L21/762;H01L23/48;H01L23/482;(IPC1-7):H01L21/768;H01L23/52;H01L21/78;H01L29/06 |
主分类号 |
H01L21/60 |
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