| 摘要 |
PROBLEM TO BE SOLVED: To provide a distributed control type wafer polishing device capable of reducing a load on the host computer of a wafer polishing device, eliminating the need of a cable for transfer raw data from an operating part, and controlling utilities such as air, vacuum and water at the use end thereof without using a centralized control by the host computer. SOLUTION: Control equipment for controlling the utilities such as air, vacuum, and water for pressing a wafer 50 against a polishing pad 20 and a microcomputer 46 having a data storage means, calculation means, and input/output means, sending and receiving signals from an external part, and controlling the control equipment are incorporated in a holding head 14 for holding the wafer 50. The microcomputer 46 communicates with the host computer, and controls the utilities at the use end thereof. |
