| 摘要 |
PROBLEM TO BE SOLVED: To provide a vacuum deposition apparatus for forming a thin film on a substrate with the use of a corrective plate, which reduces deposits transferred from the corrective plate to the substrate, uniformly heats the substrate to improve the film quality, and further installs a reversal mechanism to conduct an effective vapor deposition onto both sides of the substrate. SOLUTION: The vacuum deposition apparatus comprises a vacuum deposition vessel 1, and a vacuum vessel 3 for the substrate and a vacuum vessel 5 for the corrective plate, both of which are connected with the vacuum deposition vessel each through a gate valve 2 or 4. The vacuum deposition vessel 1 has a mechanism for driving a holder 7 for holding the substrate so as to rotate and revolve. The substrate holder 7 and the corrective plate 9 for correcting a distribution of film thickness on the substrate are separately carried into the vapor deposition vessel 1 respectively from the vacuum vessel 3 and the vacuum vessel 5, to be vapor deposited. Furthermore, the vacuum vessel for the substrate can have the reversal mechanism for reversing the substrate holder to enable both sides of the substrate to be vapor deposited.
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