| 摘要 |
PURPOSE: To provide a lead frame used for a leadless package (semiconductor device) such as QFN, wherein, even if a flash occurs at dicing in a process for fabricating a semiconductor device, shorting between adjoining lead parts is effectively prevented for improved reliability of the semiconductor device while manufacturing period is shortened for less manufacturing cost. CONSTITUTION: A plurality of lead parts 33 extend, like a comb, from a frame part 34 toward a die pad part 32 on which a semiconductor element is mounted. A lead width W2, of each lead part 33, along a division line for finally dividing into semiconductor devices is formed thinner than a lead width W1 at other part of the lead part. |
