发明名称 MODULE STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a module structure capable of reducing the number of part items and saving space. SOLUTION: This module structure 10 is provided with an electric equipment casing 20 storing an electric equipment substrate 12 for an audio device and an air conditioner in the central part of an instrument panel 11. The left/right side walls 21 and 22 of the electric equipment casing 20 are integrally formed with center braces 23 and 24 respectively and the left/right center braces 23 and 24 are fitted to a reinforcement 40. A sub-wire harness 43 branched from an instrument panel wire harness 42 of the reinforcement 40 is inserted into a wiring groove 23a formed inside the center braces so as to be directly connected to the electric equipment substrate 12 in the electric equipment casing.
申请公布号 JP2003118429(A) 申请公布日期 2003.04.23
申请号 JP20010314091 申请日期 2001.10.11
申请人 YAZAKI CORP 发明人 SASAKI HISANORI;SATO HARUHIKO
分类号 B60R16/02;B60K37/04;B60R11/02;B61D19/00;H02G3/04;H02G3/38 主分类号 B60R16/02
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