发明名称 HEAT TREATING DEVICE AND METHOD
摘要 PROBLEM TO BE SOLVED: To provide a heat treating device capable of improving temperature rise speed without causing warp and slip of a workpiece. SOLUTION: This heat treating device is provided with a treating unit 24 performing a prescribed heat treatment to the work piece W. The treating unit is provided with a treating vessel 26 formed of an optical transparent member, a support member 36 supporting the workpiece, upper part heating means 70 provided outside a ceiling part of the treating vessel, lower part heating means 72 provided outside the bottom of the treating vessel, a gas introducing means 50 introducing treating gas into the treating vessel, and exhaust means 40 exhausting atmosphere in the treating vessel. The workpiece is heated from the both sides so as to improve the temperature rise speed without causing the warp and the slip of the workpiece.
申请公布号 JP2003121079(A) 申请公布日期 2003.04.23
申请号 JP20010313218 申请日期 2001.10.10
申请人 TOKYO ELECTRON LTD 发明人 FUKUSHIMA HIROKI;NAKAO MASARU
分类号 F27B17/00;F27B5/14;F27B5/16;F27D7/02;F27D7/06;F27D11/02;(IPC1-7):F27B17/00 主分类号 F27B17/00
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