| 摘要 |
PROBLEM TO BE SOLVED: To provide a liquid epoxy resin composition which enables repairs of even an electronic part device having nonconformity in the electrical connection even after once conducting underfill. SOLUTION: The liquid epoxy resin composition is to seal, with a resin, a gap between a circuit board of an electronic part device on which a semiconductor element is mounted and the semiconductor element in the state of allowing an electrode part for connection provided for the semiconductor element to face an electrode part for connection provided for the circuit board. The above liquid epoxy resin composition comprises (A) a liquid epoxy resin, (B) a curing agent, and (C) an inorganic filler and, in addition, (D) an N,N,N',N '-four substituted fluorine-containing aromatic diamine compound.
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