| 摘要 |
PURPOSE: To provide an electronic component device which can be repaired even in the case where the electronic component device is encountered with an undesirable condition in an electric connection after it had once an under fill. CONSTITUTION: The electronic component device has such a structure that, in a state where a connection electrode (solder bump) 3 placed on a semiconductor element (flip chip) 1 and a connection electrode (solder pad) 5 placed on a wire circuit board 2 are facing to each other, the semiconductor element (flip chip) 1 is loaded on the wire circuit board 2. A gap between the wire circuit board 2 and the semiconductor element (flip chip) 1 is resin-sealed with a sealing resin layer 4 consisting of a liquid epoxy resin composition containing the following components (A) to (C), and the following component (D). (A) a liquid epoxy resin. (B) a curing agent. (C) an inorganic filler. (D) a fluorine- containing aromatic diamine compound having four substituents at N,N,N',N'.
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