LAMINATE AND MULTILAYERED PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a conductor layer/polyimide film/adhesive laminate suitable for manufacturing a multilayered printed wiring board having high heat resis tance, a narrow pitch wiring pattern, small diameter viaholes, uniform insulating layer thickness and the properly low coefficient of linear expansion, excellent in surface smoothness and solder heat resistance and having high reliability. SOLUTION: The laminate is constituted by providing a conductor layer on one surface of a polymeric film and providing an adhesive layer on the other surface thereof. A resin composition constituted of a polyimide comprising a specific ester acid dihydrate and a specific diamine and an epoxy resin is used in the adhesive layer.