CUTTING METHOD OF CYLINDRICAL CRYSTAL BY WIRE SAW

摘要

PROBLEM TO BE SOLVED: To provide a cutting method of a cylindrical crystal by wire saws capable of reducing irregularity of the wafer thickness even if the cylindrical crystal such as a compound semiconductor crystal and a silicon crystal is cut in a wafer shape by using a wire saw cutter having no speed variable mechanism. SOLUTION: This method cuts the cylindrical crystal in a wafer shape by a plurality of wire saws sent in parallel, and cuts a dummy material simultaneously with the cylindrical crystal by respectively vertically erectly arranging the dummy material of two plate materials having hardness higher than the cylindrical crystal in the sending direction of the wire saws so as to sandwich the cylindrical crystal. The cylindrical crystal is desirably the compound semiconductor crystal or the silicon crystal. The dummy material is desirably a glass pane.