| 摘要 |
<p>A process for fastening a miniaturized component (2), in particular assembled in a modular manner, on a baseplate (1) by a solder joint is described. A side (4) of the component (2) is coated with a layer (5) of solder material, and the baseplate (1) is at least partly coated with a layer of metal (6, 6', 6''). The component (2) is arranged above the baseplate (1), the metal layer and the layer (5) of solder material being a vertical distance apart and not in contact with one another. Heat energy is then supplied from the side of the baseplate (1) for melting solder material of the layer (5) of solder material on the side (4) of the component (2) until a drop forms, with the result that the drop (5') of solder material fills the space between the component (2) and the baseplate (1) for mutual fastening.</p> |
