| 摘要 |
PROBLEM TO BE SOLVED: To provide a flame-retardant resin composition that has high moisture resistance, high moisture absorption solder heat resistance, includes no halogen- based flame retardant and no phosphorus-based flame retardant and is suitable as a printed circuit board and as a semiconductor substrate, a resin varnish including the same, a prepreg obtained by using the same, a flame retardant base board formed by laminating the prepreg and a flame retardant laminated board formed by integrally laminating a metal foil or plate on the flame retardant base board. SOLUTION: The flame-retardant resin composition comprises (A) a specific polymaleimide compound, (B) an epoxy resin bearing at least two glycidyl groups in the molecule, (C) a phenolic resin bearing at least two OH groups in the molecule, (D) aluminum hydroxide. The component (A) is included in an amount of >=2.5 mass % based on the total mass of the resin component calculated as nitrogen atom, while the component (D) is included in an amount of 25-250 pts. by mass when the total of the resin components is calculated as 100 pts. by mass.
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