| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing that has excellent moldability without warpage and reduced resin cracking due to the reflow at elevated temperature because a higher reflow temperature is required than the conventional one when a lead-free solder is used and conventionally more cracks occurs in the resin as the reflow temperature is raised. SOLUTION: The epoxy resin composition for sealing comprises (A) a spiro ring-bearing epoxy resin, (B) a phenolic resin, (C) a hardening accelerator, (D) a coupling agent and (E) a silica powder as essential components wherein the content of (E) the silica powder is 70-95 wt.%.
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