| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition which excels in photosensitivity and developability, excels in the flexibility, soldering heat resistance, resistance to thermal deterioration, and resistance to electroless gold plating of a cured product, and is suited particularly in use as a soldering resist and an interlayer insulating layer. SOLUTION: The resin composition comprises (A) an oligomer to be obtained by reacting (a) an epoxy resin having at least two epoxy groups per molecule, (b) a compound having two hydroxy groups and one carboxy group per molecule, (c) a carboxy group-containing rubbery polymer, and (d) an unsaturated group-containing monobasic acid.
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