Semiconductor device and method of fabrication thereof, circuit board, and electronic equipment

摘要

A method of fabricating a semiconductor device including: a first step of bonding a conductive wire to any one of a plurality of electrodes of a semiconductor chip; a second step of tearing off the bonded conductive wire in such a manner that a part remains on one of the electrodes; a third step of pressing the part of the conductive wire remaining on the one of the electrodes, to form a bump having a head portion and a base portion; and, a fourth step of bonding a lead to the bump; wherein a distance D between an upper surface of the base portion of the bump and an upper surface of the head portion is such that: 0<D<=6 mum.