Vehicular modular design multiple application rectifier assembly having outer lead integument

摘要

A rectifier assembly includes two substantially identical and interchangeable heat sink plates mounted parallel to each other in spaced relation. Each heat sink plate has a plurality of identically positioned diode mounting holes. A plurality of rectifier diodes are mounted within the diode mounting holes such that plates are selectively negative or positive depending on the plurality of diodes mounted within the plate. A lead integument formed from an insulator material is mounted on a heat sink plate opposing the other heat sink plate and has embedded conductors and connectors that interconnect diode electrodes and other rectifier components.