Method for forming a package for electronic components and package for electronic components

摘要

A package (30) for electronic components comprises substantially sheet-like elements in a stack, the elements comprising; a heat sink (32), a flexible substrate (34) carrying at least one conductor layer (36) and at least one electronic component (40) mounted on a component attach layer (38), a gap filler (42) and a lid (44); wherein the gap filler applies a pressure to the flexible substrate such that it is in mechanical contact with the heatsink when the lid and heatsink are locked together by the frame (45). The package requires no adhesive to remain together and can easily be combined with ribbon cables and is easy to disassemble.