Systems and methods for application of substantially dry atmospheric plasma surface treatment to various electronic component packaging and assembly methods

摘要

This invention is related to a method for encapsulating bond regions in electronic components comprising, for example, metallic bond regions, the method comprising the steps of exposing an electronic component having at least one bond region through a primary gas atmosphere comprising unstable or excited gaseous species, the gaseous species being substantially devoid of any electrical charges, the primary gas atmosphere having a pressure ranging from about 0.5x105 Pa to about 3.0x105 Pa, thereby forming a treated, non-encapulated electronic component, then encapsulating the electronic component.