发明名称
摘要 PROBLEM TO BE SOLVED: To provide a chip sorting device and method for sorting and housing the chips of a wafer in trays with respect to characteristics in order to avoid mixedly mounting of the chips of the different characteristics on the same printed board. SOLUTION: Plural trays 25 are mounted on a turntable 24. The chip of the wafer 1 is picked up by a transfer head 31, the transfer head 31 is turned and the chip is transferred to the upper part of the tray 25. The characteristics of the chip are inspected and registered in a chip characteristic data storage part beforehand and the chip is housed in the tray 25 for the respective characteristics corresponding to the data. The tray 25 filled with the chips is chuck by a chuck pawl 7 and recovered to the prescribed position of a stocker for the respective characteristics of the chip.
申请公布号 JP3399308(B2) 申请公布日期 2003.04.21
申请号 JP19970232060 申请日期 1997.08.28
申请人 发明人
分类号 G01R31/26;B65G47/46;H05K13/02 主分类号 G01R31/26
代理机构 代理人
主权项
地址
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