| 摘要 |
PROBLEM TO BE SOLVED: To relax the stress due to the difference in thermal expansion generated between a land grid array package and a printed wiring board, by electrically connecting a terminal electrode of the package and an electrode of the printed wiring board by a cotton-like connection medium formed by using a conductor. SOLUTION: In a land grid array package 1, a terminal electrode 2 of the land grid array package 1 and an electrode 7 of a printed wiring board 6 are electrically connected with each other via a spherical connector 5 formed by using a conductor. Therefore, when the package 1 and the printed wiring board 6 are connected, the connector 5 functions as an absorber. Thus, even in the case where a stress is generated by the difference in thermal expansion between the package 1 and the printed wiring board 6 due to a change in environment temperature, the stress may be prevented from acting on the connection part between the package 1 and the printed wiring board 6 by deformation of the connector 5. |
