发明名称 POLYAMIDE RESIN COMPOSITION AND METHOD FOR PRODUCING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a polyamide resin composition suitable as a molding material such as a structural material utilizing excellent moisture resistance and impact resistance related to surface impact such as falling weight impact. SOLUTION: This polyamide resin composition having the structure controlled to a two-phase continuous structure having 0.01-1μm structural period or a dispersed structure having 0.01-1μm center distance of dispersed particles. A method for producing the polyamide resin composition comprises carrying out phase separation of a polyamide resin composition composed of at least two or more components of resins and containing one or more kinds of polyamide resins by spinodal decomposition. Furthermore, the method for producing the polyamide resin composition comprises forming the two-phase continuous structure having 0.001-0.1μm structural period in the initial process of the spinodal decomposition and then further developing the resultant structure into the two-phase continuous structure having 0.01-1μm structural period or the dispersed structure having 0.01-1μm interparticle distance.
申请公布号 JP2003113304(A) 申请公布日期 2003.04.18
申请号 JP20020016242 申请日期 2002.01.24
申请人 TORAY IND INC 发明人 KOBAYASHI SADAYUKI;KUMAKI JIRO
分类号 C08J3/20;B29B11/14;B29K77/00;C08L77/00;C08L101/00;(IPC1-7):C08L77/00 主分类号 C08J3/20
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