METHOD AND APPARATUS FOR SUBSTRATE TREATMENT

摘要

PROBLEM TO BE SOLVED: To provide a substrate treatment apparatus whose occupation area is small and operation efficiency is high. SOLUTION: A plurality of reaction chambers 70 are provided to a wall 53 of a wafer carry chamber 50 separated apart each other stacked in the vertical direction. A plurality of wafer storage chambers 30 are provided to a wall 54 of the wafer carry chamber 50 apart mutually stacked in the vertical direction. A gate valve 93 is provided between a plurality of reaction chambers 70 and the wafer carry chamber 50, and a gate valve 92 is provided between a plurality of wafer storage chambers 30 and the wafer carry chamber 50. The wafer carry chamber 50 is constituted capable of being evacuated, and a wafer carry vacuum robot 60, which can carry a substrate in vacuum, in between the reaction chamber 70 and the wafer storage chamber 30, is provided in the inside thereof.