| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer ring sticking residue removal apparatus and its method for enabling the reuse of a wafer ring by surely removing a sticking residue remaining in a wafer ring. SOLUTION: In the apparatus and the method, a sticking residue 8 which is firmly stuck to a wafer ring 10 is heated and softened by a heating apparatus 4, a heated sticking residue 8' on the surface of a heated wafer ring 10' is rapidly cooled by a cooling device 5 to be easily peeled, a scraper device 6 with a knife whose hardness is lower than that of a wafer ring is made to apply pressure to a cooled sticking residue 8" for peeling and removing it, a thin film-like cooled adhesive residue 8" which is still kept is wiped by a wiping member of a wiping device 7 and the sticking residue is removed from the surface of the wafer ring 10. |
