MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a QC method of a memory cell interlaminar film which can be carried out readily in a short time by using a memory array and a single memory formed in a scribe region without subjecting a memory cells to stress, and to provide a manufacturing method of a non-volatile semiconductor memory device by adopting the QC method. SOLUTION: After a single nonvolatile memory is formed in a region which is different from a chip on a semiconductor wafer and an interlaminar film QC process for evaluating write-in saturation properties using a single memory is adopted after a wafer manufacturing process is finished, only nondefective items are cut out to chips and subjected to resin sealing. Thereby, yield after cutting to the chip can be improved.