发明名称 |
METHOD OF CORRECTING OVERLAY OF SEMICONDUCTOR WAFER |
摘要 |
PURPOSE: A method of correcting the overlay of a semiconductor wafer is provided to enhance the productivity of the semiconductor wafer by reducing the degree of overlay scattering and the number of sample recommends. CONSTITUTION: The overlay error correction value for the semiconductor wafer exposed to light by way of a stepper equipment is measured(103). The measured overlay error correction value, the variation of the stepper equipment due to the learning of input variation, and the weighted value of the pre-established plural numbers of rots are summed up to thereby produce an overlay error correction value(104). The resulting overlay error correction value is fed to the stepper, and the light exposing with respect to the next rot is subsequently made(105).
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申请公布号 |
KR20030030427(A) |
申请公布日期 |
2003.04.18 |
申请号 |
KR20010062565 |
申请日期 |
2001.10.11 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
CHO, BONG SU;KANG, HYEON TAE;PARK, CHAN HUN |
分类号 |
H01L21/027;G03F7/20;(IPC1-7):H01L21/027 |
主分类号 |
H01L21/027 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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