| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly reliable water-cooled inverter structure in which the temperature of a power semiconductor module and a control circuit board can be lowered. SOLUTION: A plurality of shallow recesses and deep recesses are formed in a housing, and the bottom face of a power semiconductor module is bonded into the shallow recess to form a water channel for cooling the power semiconductor module directly. Since the current velocity of cooling water in the shallow recess is high, cooling efficiency can be enhanced and pressure loss can be reduced in a deep channel formed by the deep recess. Since a plurality of recesses are provided, the power semiconductor module can be reduced in size, and since a plurality of power semiconductor modules can be arranged, reliability can be enhanced. The temperature of a control circuit can be lowered by disposing a control board below the water channel thereby isolating it from the power semiconductor module. Since the temperature of the power semiconductor module and the control circuit board can be lowered, a highly reliable water-cooled inverter structure can be realized. |
