| 摘要 |
<p>PROBLEM TO BE SOLVED: To grind the backside of a semiconductor chip in the same handling manner as a wafer. SOLUTION: A plurality of semiconductor chips 2 are arranged with their surfaces upward on a tape mounting tray 4 in conformity with the shape of a wafer. A protective adhesive tape 1 having the same shape as the wafer is pasted to the chips 2 to form a dummy wafer 3 having a wafer shape with the chips' backsides exposed and hence the dummy wafer 3 is set in an existing wafer back grounder to grind the backside of the chip 2. After grinding the backside of the chips 2, the wafer 3 is mounted on a frame 14 with a dicing tape 16, the protective adhesive tape 1 is peeled off and the individual semiconductor chips 2 are picked from the dicing tape 16.</p> |
