| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for easily manufacturing a wiring board used for a package for storing elements. SOLUTION: The manufacturing method of a package for storing elements comprises a process for preparing a first substrate having a flat section, a process for forming a plurality of projections that are provided around a specific region in the flat section, a process for wiring the flat section via the region among the plurality of projections from the specific region to the outside of the specific region, and a process for depositing an insulating film that is provided by sandwiching the wiring so that the regions among the plurality of projections is filled.
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