| 摘要 |
PURPOSE: A room temperature curable organopolysiloxane composition is provided, to allow the composition to generate no low molecular weight siloxane and no organic materials as time goes by, after curing for apply it as a sealing material for a clean room and an adhesive or a sealant for electronic parts. CONSTITUTION: The organopolysiloxane composition comprises 100 parts by weight of diorganopolysiloxane which contains 0.1 wt% or less of a low molecular weight organopolysiloxane having a vapor pressure of 10¬-12 mmHg or more at a temperature of 20 deg.C and is terminal-capped with a hydroxyl group, an alkoxy group or an alkenoxy group; and 0.5-30 parts by weight of a silane compound having a radical represented by the formula 1 or its partial hydrolysate, wherein R1 and R2 are independently H or a substituted or unsubstituted monovalent hydrocarbon group. Optionally the organopolysiloxane composition comprises further 0.01-10 parts by weight of an organosilicon compound having a radical represented by the formula 2 and its partial hydrolysate, wherein R3 and R4 are independently H or a substituted or unsubstituted monovalent hydrocarbon group.
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