发明名称 PHOTORESIST REMOVER
摘要 PROBLEM TO BE SOLVED: To provide a photoresist remover excellent in property of preventing corrosion of metal wiring of both Al and Cu, excellent also in power to remove a photoresist film and residue after ashing and causing no precipitation of an anticorrosive. SOLUTION: The photoresist remover comprises (a) the salt of hydrofluoric acid and a metal ion-free base, (b) a water-soluble organic solvent, (c) a mercapto-containing anticorrosive and (d) water. When ammonium fluoride is used as the component (a), (e) the salt of hydrofluoric acid and a specified quaternary ammonium hydroxide (such as tetramethylammonium hydroxide or tetrapropylammonium hydroxide) and/or an alkanolamine may further be added.
申请公布号 JP2003114539(A) 申请公布日期 2003.04.18
申请号 JP20010392290 申请日期 2001.12.25
申请人 TOKYO OHKA KOGYO CO LTD 发明人 YOKOI SHIGERU;WAKIYA KAZUMASA
分类号 C23F11/00;G03F7/42;H01L21/027;H01L21/304;H01L21/311;H01L21/3213;(IPC1-7):G03F7/42 主分类号 C23F11/00
代理机构 代理人
主权项
地址