| 摘要 |
PURPOSE: Etching treatment equipment for etching an edge surface of a wafer is provided to prevent production yield of the wafer from being reduced by clearly etching the oxide boundary of the wafer using an etching solution. CONSTITUTION: An etching solution storage container(49) is provided at the bottom of a case(41). A plurality of barrel supports are vertically built on a top plate over the etching solution storage container(49) while bearing insertion holes proceeding from the top to the bottom. A barrel front member(22) where front wafer rotation rollers fitted among a plurality of support plates are rotatably installed together with front small diameter gears(28) is movably placed at the opening front side of a barrel(13). Rear wafer rotation rollers are rotatably installed at the opening rear side of the barrel(13) together with rear small diameter gears(21). A large diameter gear(16) is rotatably installed at both lateral sides of the barrel(13) opposite to each other while being coupled to the front small diameter gears(28) and the rear small diameter gears(21). The barrel(13) has a plurality of inner wafer support protrusions. The wafers are stored at the barrel(13) while being spaced apart from each other by a predetermined distance by way of the wafer support protrusions. An etching solution supply unit(50) has a plurality of rollers each having a sponge roll(53c) at its periphery rotatably installed at the etching solution storage container(49). The gear installed at the axis of any one of the rollers is coupled to the large diameter gear(16), and the sponge roll(53c) contacts the etching solution and the edge of the water at the same time.
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