发明名称 SINGLE CRYSTAL GaN SUBSTRATE, METHOD FOR GROWING SINGLE CRYSTAL GaN AND METHOD FOR MANUFACTURING SINGLE CRYSTAL GaN SUBSTRATE
摘要 <p>PURPOSE: A single crystal GaN substrate, a method for growing single crystal GaN and a method for manufacturing the single crystal GaN substrate are provided to be capable of exactly controlling the positions of voluminous defect accumulating regions and obtaining a low voltage GaN substrate. CONSTITUTION: A GaN epitaxial layer(42) having a thickness of about 2μm, is formed at the upper portion of a sapphire substrate(41) by carrying out an MOCVD process. At this time, the surface of the GaN epitaxial layer becomes the 'C' surface of GaN. After forming an SiO2 layer having a thickness of 100 nm, at the upper portion of the resultant structure, a mask pattern(43) is formed by selectively patterning the SiO2 layer. At this time, the mask pattern is formed into a stripe type structure for exposing the predetermined portions of the GaN epitaxial layer.</p>
申请公布号 KR20030030917(A) 申请公布日期 2003.04.18
申请号 KR20020061417 申请日期 2002.10.09
申请人 SUMITOMO ELECTRIC INDUSTRIES, LTD. 发明人 MOTOKI KENSAKU;HIROTA RYU;OKAHISA TAKUJI;NAKAHATA SEIJI
分类号 C30B29/38;C30B23/02;C30B25/02;H01L21/20;H01L21/205;H01L33/32;(IPC1-7):H01L21/20 主分类号 C30B29/38
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