发明名称 DRY ETCHING GAS AND METHOD FOR DRY ETCHING
摘要 A dry etching gas that comprises a compound having a CF3CF fragment directly bonded to a double bond (provided that the compound is exclusive of CF3CF═CFCF═CF2). Said dry etching gas permits the formation of a pattern such as a contact hole with a high aspect ratio.
申请公布号 KR20030031180(A) 申请公布日期 2003.04.18
申请号 KR20037003418 申请日期 2003.03.07
申请人 发明人
分类号 H01L21/3065;H01L21/3105;H01L21/311;H01L21/768 主分类号 H01L21/3065
代理机构 代理人
主权项
地址