| 摘要 |
<p>PROBLEM TO BE SOLVED: To make the upper surface of sealing resin and the upper surface of a substrate the same surface when a chip mounted on a recessed part of the substrate is resin-sealed, and restrain the number of working processes. SOLUTION: This resin sealing equipment is provided with a drag 1, a cope 2, a pot 8, a substrate accommodating part 4 and protruding pin 11 which are disposed in the drag 1, a plunger 9 disposed in the pot 8, a cull 14, a runner 15 and a gate 16 which are disposed in the cope 2, and a fixing pin 17 fixed to the gate 16. A resin film 12 is disposed under tension between the drag and the cope, in a state of the substrate 3 having the recessed part 6 being accommodated in the substrate accommodating part 4. By clamping, the resin film 12 is closely brought into contact with the upper surface of the substrate, and an aperture 18 is formed in the resin film 12 by using the fixing pin 17. Fused resin in the pot 10 is injected in the recessed part, passing the cull 14, the runner 15, the gate 16 and the aperture 18 in sequence, and is then cured.</p> |
