| 摘要 |
PROBLEM TO BE SOLVED: To provide a photo-curing type sheet for temporary fixing forming an adhesive layer on a substrate, having sufficiently strong adhesive force to a material to be treated such as wafer before curing the adhesive layer, capable of surely protecting or fixing the material to be treated such as wafer, having sufficiently weak adhesive force to the material to be treated such as wafer and capable of readily peeling the material to be treated such as wafer (or chip) in a good state scarcely leaving the paste from the sheet for temporary fixing. SOLUTION: This photo-curing type sheet 1 for temporary fixing comprises forming an adhesive layer 3 on a base 2. The adhesive layer 3 comprises a reactive polymer having <=20 deg.C glass transition temperature before curing and containing 1-100 mol% photopolymerizable functional group as a main component. |
