ORGANIC SILICATE POLYMER AND LOW DIELECTRIC CONSTANT INSULATING FILM CONTAINING THE SAME

摘要

PURPOSE: Provided are a low dielectric constant material used as a wiring interlayer insulating film having ultra-low dielectric constant, which is capable of reducing a consumed wattage of semi-conductor device, and substantially decreasing an interference of metal wire, and a low dielectric constant insulating film containing the same. CONSTITUTION: The organic silicate polymer comprises a hydrolyzed polycondensate of (a) at least one of nitrogen-containing silane compound represented by formula 1, and (b) at least one silane compound selected from the group consisting of compound represented by formula 2 and bridge-contained silane compound represented by formula 3. Formula 1: R1p-Si-(NR22)4-p. Formula 2: SiR3qR44-q. Formula 3: R5rR63-r-M-SiR7sR83-s. In the formulas, R1, R3, and R5-R7 are independently hydrogen, aryl, or linear or branched C1-C4 alkyl which is unsubstituted or substituted with fluorine, R2 is linear or branched C1-C4 alkyl, p, q, r and s are independently integer of 0-2, and R4, and R6-R8, which are hydrolysable group, are independently acetoxy, hydroxy, or linear or branched C4-C4 alkoxy.