发明名称 DUMMY BALL FOR BARREL PLATING
摘要 PROBLEM TO BE SOLVED: To provide a dummy ball for barrel plating, which little contaminates a bath and solves environmental problems on Pb, and which is used for an external electrode formed on the surface of electronic components by electrolytic plating. SOLUTION: The dummy ball for barrel plating comprises metals including Sn as a main component and no Pb, and has Vickers hardness preferably of 13 Hv or higher, more preferably of 17 Hv or higher.
申请公布号 JP2003113499(A) 申请公布日期 2003.04.18
申请号 JP20020125516 申请日期 2002.04.26
申请人 HITACHI METALS LTD 发明人 SATO KOJI;DATE MASAYOSHI;KUBOI TAKESHI
分类号 C25D7/00;C22C13/00;C25D17/16;(IPC1-7):C25D17/16 主分类号 C25D7/00
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