| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain thin integrated electronic components where circuit characteristics can be improved and undesired radiation of electromagnetic waves is extremely small by adopting a structure that leaves the diameter of a soldering ball electrode as it is and makes thin a passive element as much as possible packaged between a substrate internal layer section or the integrated electronic component and a mother substrate, and to obtain an electronic component device and a method for manufacturing the electronic component device. SOLUTION: In an electronic component device 100 that is one embodiment, an interposer substrate 300 where an IC chip S is packaged onto one surface and a plurality of soldering ball electrodes 213 are formed on the other is packaged onto a mother substrate 110, a thin type passive component Pa having a height not higher than the height of the soldering ball electrode 213 is packaged on the side of the mother substrate 110 opposite to a position where the IC chip S of the interposer substrate 300 is packaged to avoid a pad section 316 where the soldering ball electrode 213 is connected.</p> |
