| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method and a manufacturing device for a circuit body that, in conformity with a work for electrical connection between fine circuit patterns and circuits, only a necessary minimum target portion can be highly efficiently joined, it is effective to steep reduction of a material and work cost, and besides high reliability on wiring can be obtained. SOLUTION: Since molten solder 50 formed into solder pellets 51 which are injected and locally supplied to a target portion between, for example, objective first and second conductor circuits 21 and 22, based on secondary and three-dimensional coordinate data, where respective positions, shapes, and a pitch between circuits are stored, in conductor circuits 21-25 to form a circuit body on an insulation substrate 20, a joint 52 is covered by other third conductor circuit 23. Erroneous connection does not occur, and reliability on wiring is improved. Further, since the solder pellets 51 are locally supplied, an unnecessary heat is not worked on the insulation substrate 20 throughout a wide range, and deformation due to a thermal stress can be prevented from occurring.
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