| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for soldering an IC and a printed wiring substrate that positioning by a hand work of a plurality of the solder patterns of printed surface of a substrate body and a plurality of terminal pins of an electric part, such as IC, can be accurately effected, and work efficiency can be improved by shortening a time needed for the positioning, and reduction of defective, such as defective soldering, can be realized. SOLUTION: In a printed wiring substrate, a plurality of solder patterns 4 to solder a plurality of terminal pins 4 of a surface mounting type IC2 are printed on a printed surface 1a of a substrate body 1. The shapes of solder patterns 4A and 4B corresponding to at least one spot of each side of the terminal pin 3 situated at a corner between the adjoining sides of the IC2 have a plurality of protrusions 4a, 4b and 4c, 4d and 4e. After the tips of the terminal pins 3 and 3 corresponding to a line to couple together the protrusions 4a, 4b and 4c, 4d and 4e are joined together and positioning of the IC2 is effected, the terminal pin 3 and the solder patterns 4, 4A, 4B and 4C are soldered together.
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